Gan, C. L., & Huang, C. Y. (2025). Electronic Materials Innovations and Reliability in Advanced Memory Packaging. Springer Nature.
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Chicago Style (17th ed.) Citation
Gan, Chong Leong, and Chen Yu Huang. Electronic Materials Innovations and Reliability in Advanced Memory Packaging. Springer Nature, 2025.
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MLA (9th ed.) Citation
Gan, Chong Leong, and Chen Yu Huang. Electronic Materials Innovations and Reliability in Advanced Memory Packaging. Springer Nature, 2025.
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Warning: These citations may not always be 100% accurate.