Lau, J., & Fan, X. (2025). Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration. Springer Nature.
Successfully copied to clipboard
Copying to clipboard failed
Chicago Style (17th ed.) Citation
Lau, John, and Xuejun Fan. Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration. Springer Nature, 2025.
Successfully copied to clipboard
Copying to clipboard failed
MLA (9th ed.) Citation
Lau, John, and Xuejun Fan. Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration. Springer Nature, 2025.
Successfully copied to clipboard
Copying to clipboard failed
Warning: These citations may not always be 100% accurate.