Interconnect Reliability in Advanced Memory Device Packaging
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| Autor Principal: | |
|---|---|
| Outros autores: | , , |
| Formato: | eBook |
| Idioma: | inglés |
| Publicado: |
Springer Nature,
2023.
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| Subjects: | |
| Acceso en liña: | Access eBook |
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| 001 | 22455 | ||
| 005 | 20261004182542.0 | ||
| 008 | 261004s2023 o 000 eng | ||
| 020 | |a 978-3-031-26708-6 | ||
| 100 | 1 | |a Leong, Chong |9 48230 | |
| 700 | 1 | |a Gan |9 48231 | |
| 700 | 1 | |a Chen-Yu |9 39195 | |
| 700 | 1 | |a Huang |9 48232 | |
| 245 | 0 | 0 | |a Interconnect Reliability in Advanced Memory Device Packaging |
| 260 | |b Springer Nature, |c 2023. | ||
| 300 | |a 1 online resource | ||
| 650 | 4 | |a Engineering | |
| 538 | |a Mode of access: World Wide Web. | ||
| 856 | 4 | 0 | |u https://library.mist.ac.bd/ebooks/8926/go?src=vufind |z Access eBook |
| 942 | |c EBOOK | ||
| 999 | |c 22455 |d 22455 | ||